A Computer Simulation of an Agitation Mill Abrasion Process for Waste Printed Circuit Boards

The mechanism of an abrasion process to recover metal values by removing components from printed circuit boards (PCBs) is modeled using a discrete element method (DEM) simulation. To simulate the abrasion process, a model PCB geometry was constructed consisting of bonded particulates. The simulation allowed connections between particles to be broken if the bonding force calculated from DEM exceeded a threshold level. Simulation results were compared with experimental comminution data using an agitation mill with test PCBs on which nine capacitors were surface solder-mounted. Simulation results obtained from the DEM with the anchoring model corresponded to experimental observations.